Barcelona, Spain, Feb. 28, 2024/PRNewswire/ -- On February 26, 2024, MWC 24, an international communications industry event, was held in Barcelona, Spain. Top companies in global communications and related supply chains gathered to showcase cutting-edge research results in the field of mobile communications and conduct in-depth technical exchanges with international industry colleagues. As a service provider for RF front-end integration solutions, Sanan Integrated attended MWC for the first time and showcased the latest developments in process nodes and product spectrum to international customers at the 3A1Ex booth, which attracted widespread attention in the international market.

As the most influential global exhibition in the field of communications, MWC Barcelona is regarded as a weather vane for the global mobile communications industry. With the theme of “Future First”, MWC 24 brings together leading companies in cutting-edge mobile communication technology, smart phones, network technology, the Internet of Things, and cloud computing to discuss future mobile communication trends.

Since the Group's business integration in August 2023, Sanan Integrated has now become a dedicated injection frequency front-end integration solution company under San'an Optoelectronics. Its main business is RF front-end chip manufacturing, which is subdivided into three product lines: GaAs RF foundry, filters, and advanced application packaging. In 2024, which is known as the first commercial year of 5G-A, the digitalization and intelligence of network connections will further advance, placing higher demands on RF front-end chip manufacturing standards. Sanan Integrated is fully prepared to embrace a more prosperous 5G-A era with global communications industry customers.

“San'an Integrated's RF front-end chip manufacturing has shown an excellent level of performance and quality, and has been widely recognized by mobile phone brands and ODM manufacturers in the Chinese market. “Therefore, we hope to further expand our service landscape, communicate strategic layout with customers on international platforms such as MWC, and listen widely to customer needs, so that we can grasp a global perspective and do a good job in chip manufacturing services in the long term.”

San'an's integrated gallium arsenide RF HBT and pHEMT processes fully support customer design requirements in 4/5G bands such as sub-3G and sub-6GHz. Based on the self-developed LT substrate patent process, Sanan Integrated provides comprehensive high-performance TC-SAW and HP-SAW filter products, combined with packaging capabilities for advanced applications such as WLP, to help customers achieve higher energy efficiency and smaller space consumption RF module designs. Under the requirements of large data throughput, high link density, low latency and high reliability in the 5G-A era, Sanan Integrated will continue to invest in process research and development to continuously improve the performance and reliability of technology and products.