Gelonghui, Feb. 28 | Dongwei Technology (688700.SH) said on the investor interactive platform that the MSAP portable VCP device independently developed by the company is not directly used in chips; the device is used to manufacture chip packaging substrates.
东威科技(688700.SH)：自主研发的MSAP移载式VCP设备不直接应用于芯片
Dongwei Technology (688700.SH): Self-developed MSAP mobile VCP devices are not directly applied to chips
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