① Samsung Electronics announced that it has successfully developed a 12-layer HBM3E and plans to begin mass production in the first half of this year; Micron Technology announced that mass production of the HBM3E has begun, and its 24GB8HBM3E products will be supplied to Nvidia. ② The increase in AI server shipments has catalyzed an explosion in demand for HBM, and along with the increase in the average HBM capacity of servers, the market size is expected to be about 15 billion US dollars in 25 years, with a growth rate of more than 50%.
Samsung Electronics announced that it has successfully developed a 12-layer HBM3E and plans to begin mass production in the first half of this year. The company did not disclose specific customers. Additionally, Micron Technology announced on the 26th that it has begun mass production of the HBM3E. Its 24GB8HHBM3E product will be supplied to Nvidia and will be applied to the NvidiaH200TensorCoreGPU. The GPU will be shipped in the second quarter of 2024.
Memory has become a core bottleneck in AI chip performance upgrades, and AI is driving strong growth in HBM demand. Nvidia released the latest AI chip H200. The memory configuration has improved markedly, and improved storage technology is the key to improving AI performance. As a high-performance DRAM based on the 3D stack process, HBM breaks memory bandwidth and power consumption bottlenecks, and GPU performance improvements drive the continuous upgrading of HBM technology. HBM's main application scenario is AI servers. According to Trendforce data, 860,000 AI servers were shipped in 2022, and AI server shipments are expected to exceed 2 million units in 2026, with a compound annual growth rate of 29%. The increase in AI server shipments has catalyzed an explosion in demand for HBM, and is accompanied by an increase in the average HBM capacity of servers. According to estimates, the market size is expected to be about 15 billion US dollars in 25 years, with a growth rate of more than 50%.
According to the Finance Federation's theme library, among the relevant listed companies:
Guoxin Technology and its partners are already carrying out high-performance interconnection IP technology work related to flow film verification based on advanced processes, and is actively cooperating with upstream and downstream partner manufacturers on high-end chip packaging, including HBM technology.
Shannon Xinchuang previously stated that the company has HBM agency qualifications as one of SK Hynix distributors. In the future, the company will form corresponding sales according to the needs of downstream customers on the premise that supply from the original factory is guaranteed.