SK Hynix Vice President Kim Ki-tae said a few days ago that the company's HBM has been sold out this year and preparations for 2025 have begun. Although external uncertainties still exist, the memory semiconductor industry has begun to show an upward trend this year. Demand for products from major global technology customers is recovering, and demand for products such as DDR5, LPDDR5T, and HBM3E is expected to increase as the field of artificial intelligence use expands, including devices equipped with their own artificial intelligence, such as personal computers and smartphones.

According to the Huachuang Securities Research Report, AI demand is strongly driven, and the storage market will experience a sharp rise in volume and price. On the PC/mobile phone side, AI can accelerate terminal configuration upgrades, and the demand for bits is expected to continue to rise. On the server side, according to Micron estimates, the amount of DRAM/NAND used in AI servers is 8 times/3 times that of traditional servers, respectively; at the same time, it has also spawned massive demand for new high-performance memories. HBM has broken through memory capacity and bandwidth bottlenecks, and is regarded as a next-generation DRAM solution, and has become an indispensable key technology in the AI era. Driven by strong AI demand, the average standalone capacity of smartphones, servers, and laptops is growing, and the server sector is growing the most.

According to the Finance Federation's theme library, among the relevant listed companies:

Yachuang Electronics stated on the investor interactive platform that WE, a wholly-owned subsidiary of the company, mainly represents Hynix's memory, and HBM will be the key direction for future layout.

Huahai Chengke's granular epoxy encapsulants (GMC) can be used for HBM packaging. The relevant products have been verified by the customer and are currently in the sample delivery stage.