TSMC held a corporate briefing. The corporation asked about the progress of advanced packaging for artificial intelligence (AI) chips. CEO Wei Zhejia pointed out that demand for advanced AI chip packaging continues to be strong. Currently, production capacity is still unable to meet strong customer demand, and the shortage of supply may continue until 2025. Wei Zhejia said that TSMC continues to expand advanced packaging production capacity this year, and plans to double its advanced packaging production capacity this year. It is still in short supply. It is estimated that production capacity will continue to expand in 2025.

Currently, one of the main packaging forms used by AI and high-performance computing chip manufacturers is TSMC CoOS. Tianfeng Securities said that with the overall increase in AI demand, leading to an increase in demand for advanced packaging, TSMC has launched a major CoWoS production expansion plan, and some CoWOS orders have spilled over, and major local sealing and testing companies are expected to benefit from it.

According to the Finance Federation's theme library, among the relevant listed companies:

Jingfang Technology focuses on advanced integrated circuit packaging services, and relies on advanced processes such as wafer-level packaging, TSV silicon through-hole, and fan-out packaging to provide customers with high-density integrated processes.

Through the advance layout of advanced packaging technologies such as multi-chip components, integrated fan-out packaging, and 2.5D/3D, Tongfu Microelectronics can provide customers with diverse Chiplet packaging solutions, and has already mass-produced Chiplet products for AMD.