On December 22, Gelonghui, on the investor interactive platform, some investors asked WeitPay (301319.SZ), “Can the company's microelectronic materials be used for HBM chip stacking and high-speed serial connections?” The company replied that the company's microelectronic materials can be used for HBM chip stacking and high-speed serial connections.
唯特偶(301319.SZ)：微电子材料可以用于HBM芯片的堆叠和高速串行的连接
Vitep (301319.SZ): Microelectronic materials can be used for HBM chip stacking and high-speed serial connection
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