Gelonghui, December 7, Jingfang Technology (603005.SH) stated on the investor interactive platform that TSV- Through Silicon Via technology is a standard process in semiconductor processing, and it has a history of decades since wafers had dry silicon etching (DRIE deep reaction ion etching) technology. With the emergence of advanced packaging technology, it has been more than ten years since this technology was successfully applied internationally to wafer packaging. Among them, Jingfang Technology entered the field of advanced TSV packaging technology as early as 2005. After years of development, the company has significant leading advantages in technology, technology, market and intellectual property rights in this field. Currently, it also has 8-inch and 12-inch TSV packaging capabilities. It has been commercialized on a large scale in CIS, MEMS, radio frequency and other market applications, and has continuously expanded new application fields, and established a global manufacturing, R&D base and intellectual property system.