Gelonghui November 29 | Yuancheng shares rose and stopped, and Lianying Laser, Xinyichang, Xing Sen Technology, and Taiji Industrial followed suit. According to the news, some industry sources revealed that SK Hynix is preparing to apply 2.5D fan-out (2.5D fan-out) packaging technology in next-generation DRAM, and will release the relevant plan in 2024 as soon as possible.
先进封装板块拉升 元成股份涨停
The advanced packaging sector boosted Yuancheng shares
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