On November 27, Gelonghui (002249.SZ) stated on the investor interactive platform that the company has not implemented a semiconductor chip packaging project at present. The company previously mastered high-power IGBT and IPM module packaging technology through cooperation with the Institute of Electrical Engineering of the Chinese Academy of Sciences, and invested in the construction of a test line for related products in Beijing with its own capital. In 2019, the company invested in Guizhou Xinchangzheng Technology Co., Ltd. (renamed “Jiangsu Xinchangzheng Microelectronics Group Co., Ltd.”) at the price of this test line and related core technology. The two sides carried out technical cooperation in the field of power devices, leveraging their respective advantages to achieve resource sharing and a win-win situation for all parties.
大洋电机(002249.SZ)：目前没有实施半导体芯片封装项目
Taiyo Electric (002249.SZ): No semiconductor chip packaging projects have been implemented
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