On November 27, Gelonghui Technology (300802.SZ) recently received research from specific targets. Regarding “introducing the application scenarios, competitors, and sales of the company's semiconductor AOI equipment,” the company stated that the company's semiconductor AOI equipment is mainly used in the packaging and testing process, and currently there are two series products on sale. Among them, the company's wafer series products can detect cracks, debris, cutting collapse, etc. on the chip surface after cutting; the company's semi series products can perform 3D inspection of defects such as bending and fracture of the welding wire in the bonding process, with a detection accuracy of 0.5 microns. Currently, the semiconductor appearance defect inspection market is mainly occupied by foreign brands such as KLA and Camtek. The company is actively promoting participation in the verification testing of sealing manufacturers. Some product models already have the ability to replace imports, and have already achieved sales. At the same time, the company successfully applied the 3D inspection technology of the SEMI series products to the bonding process to detect the appearance defects of automotive electronic power device modules, and the related products have been verified and tested with potential customers.