Gelonghui, November 3 | Kangqiang Electronics rose and stopped, Shenzhen Keda rose more than 10%, and Guoxin Technology, Canrui Technology, Qipai Technology, and VeriYuan Co., Ltd. were ahead of the increase. According to the news, according to Yole's data, advanced packaging accounted for about 39% of the global packaging market in 2014, 47% in 2022, and is expected to account for close to 50% in 2025. In the advanced packaging market, 2.5D/3D packaging has the fastest growth rate, with a CAGR of 14.34% in 2021-2027. The increase is mainly driven by applications such as AI, HPC, and HBM.
Chiplet板块拉升 康强电子涨停
Chiplet sector pulls up Kangqiang Electronics rises and stops
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