来源：智通财经 作者：魏昊铭
据知情人士透露，全球最大代工芯片制造商$台积电(TSM.US)$正在与德国政府谈判，希望获得德国政府最高50%的补贴，用于在德国新建半导体工厂。上述知情人士称，德国政府正在与台积电及其合作伙伴博世、英飞凌和恩智浦半导体(NXPI.US)就该项目进行谈判。最终决定尚未作出，最终补贴金额仍有可能改变。任何国家援助也必须得到欧盟委员会的批准。
德累斯顿工厂预计将耗资100亿欧元(107亿美元)。正在讨论的补贴上限将使德国政府对该晶圆厂的支持与日本为台积电在日本建厂提供的补贴相当。这也将超过大多数其他芯片制造商在欧洲工厂获得的最高40%补贴。
德国经济部在一份声明中表示，它正在与台积电进行“密切交流”，“目的是共同讨论投资决策的先决条件”。德国商务部没有对补贴置评，只是说政府可以根据《欧洲芯片法》(European Chips Act)为该项目提供资金。
台积电发言人称，公司正在评估在欧洲建厂的可能性，但拒绝进一步置评。台积电首席执行官在4月份曾表示，这一决定将基于客户的需求和当地政府的支持程度。
该工厂将是欧盟430亿欧元芯片法案的一大胜利，该法案旨在增加欧元区内产量，以避免未来供应链中断。自去年欧洲首次提出投资计划以来，包括意法半导体(STM.US)、格芯(GFS.US)、英飞凌和Wolfspeed(WOLF.US)在内的芯片制造商已宣布在欧洲进行新的投资。
台积电高级副总裁Kevin Zhang本周表示:“我们的目标是贴近客户。台积电董事会最早将于8月就该项目的推进做出最终决定。如果我们真的在德累斯顿建一家工厂，我们可能会从28纳米芯片一代开始。”这种芯片可以用于汽车的微控制器，将来还可以做得更小。
编辑/lambor
Source: Zhitong Finance Author: Wei Haoming
According to people familiar with the matter, the world's largest OEM chip manufacturer$Taiwan Semiconductor(TSM.US)$Negotiations are ongoing with the German government, hoping to receive a subsidy of up to 50% from the German government to build a new semiconductor factory in Germany. According to the person familiar with the matter, the German government is in negotiations with TSMC and its partners Bosch, Infineon and NXP Semiconductors (NXPI.US) on the project. A final decision has yet to be made, and the final amount of the subsidy may still change. Any country aid must also be approved by the European Commission.
The Dresden plant is expected to cost 10 billion euros (10.7 billion US dollars). The subsidy cap being discussed would make the German government's support for the fab comparable to the Japanese subsidy provided by Japan for TSMC to build a plant in Japan. This will also surpass the highest 40% subsidy that most other chip makers receive in European factories.
The German Ministry of Economy said in a statement that it is in “close communication” with TSMC “with the aim of jointly discussing the prerequisites for investment decisions.” The German Ministry of Commerce did not comment on the subsidy, but only said that the government could fund the project in accordance with the European Chips Act (European Chips Act).
A TSMC spokesperson said the company is evaluating the possibility of building a plant in Europe, but declined to comment further. The CEO of TSMC said in April that the decision would be based on customer needs and the level of support from the local government.
The factory would be a major victory for the EU's €43 billion chip bill, which aims to increase production within the Eurozone to avoid future supply chain disruptions. Since Europe first proposed investment plans last year, chipmakers including STM.US, GFS.US, Infineon, and Wolfspeed (WOLF.US) have announced new investments in Europe.
Kevin Zhang, senior vice president of TSMC, said this week: “Our goal is to be close to our customers. TSMC's board of directors will make a final decision on advancing the project as early as August. If we actually build a factory in Dresden, we'll probably start with the 28nm chip generation.” This type of chip can be used in automotive microcontrollers, and it can also be made smaller in the future.
edit/lambor
