格隆汇2月23日丨鼎龙股份(300054.SZ)于2023年02月22日在接受投资者现场参观时表示,目前公司从CMP抛光液上游的核心原材料研磨粒子开始,已经布局多种制程系列的近40种CMP抛光液产品,在国内主要晶圆客户的导入全面展开,多种产品正在客户端验证中。同时公司实现了抛光液上游原材料的自主制备,保证了抛光液产品供应链的安全稳定。目前已在武汉本部建成了抛光液一期自动化生产车间,仙桃厂区抛光液二期扩产计划力争23年投产使用。整体项目进展顺利,预计2023年产品将有放量可能。
鼎龙股份(300054.SZ):仙桃厂区抛光液二期扩产计划力争23年投产使用
Dinglong Co., Ltd. (300054.SZ): The Xiantao plant's polishing liquid phase II expansion plan aims to start production and use in 23
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