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晶方科技(603005.SH):完成对全球领先第三代半导体GaN器件设计公司VisIC的投资

Jingfang Technology (603005.SH): Completed investment in VisiC, the world's leading third-generation semiconductor GaN device design company

Gelonghui Finance ·  Jan 9, 2023 17:40

Gelonghui January 9?Jingfang Technology (603005.SH) announced that recently, the company received the share delivery documents sent by VisIC, and the company and Jingfang II Industrial Fund have completed the procedures for the remittance and delivery of related funds to increase the investment of US $50 million to VisIC. Jingfang No.2 Industrial Fund has completed the registration procedures for industrial and commercial changes related to capital increase, and completed the filing of changes in private investment funds in the China Securities Investment Fund Industry Association.

After the completion of the settlement of the investment, the company holds 18.06% of VisIC, the Jingfang II industrial fund holds a total of 33.31% of VisIC, and the company and Jingfang II industrial fund hold a total of 51.37% of VisIC.

Jingfang Technology through the Jingfang II industrial fund and investment in Israel's VisIC company is conducive to further deepening the equity cooperation with Israel's VisIC company and better promoting the strategic cooperation and business coordination between the two sides in the future. VisIC is the world's leading third-generation semiconductor GaN (gallium nitride) device designer. Its patented gallium nitride power devices can be widely used in fast charging, electric vehicles, 5G base stations and data centers, and high-power laser applications. At present, VisIC is actively cooperating with international well-known automobile manufacturers to jointly develop 800V and above high-power main-drive inverter modules to provide new electric vehicles with power devices with higher conversion efficiency, smaller module size and higher reliability. According to its own strategic planning, the company invests in VisIC, further strengthens equity cooperation, actively distributes cutting-edge semiconductor technology, and makes full use of its advanced packaging industry and technology capabilities, in order to effectively grasp the development opportunities of high-performance power products based on third-generation semiconductors in industries including new energy vehicles.

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