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SEMI:2023年半导体材料市场规模有望突破700亿美元

The market size of semiconductor materials in SEMI:2023 is expected to exceed 70 billion US dollars.

TechWeb ·  Sep 25, 2022 15:30

As the semiconductor process continues to move towards single-digit nano-nodes, advanced materials play an indispensable key role because of their impact on process yield and product stability. A few days ago, according to media reports, SEMI estimates that the market size of semiconductor materials is expected to exceed 70 billion US dollars in 2023.

Chen Mingde, Chairman of the SEMI Materials Committee and Director of Taiwan Semiconductor Manufacturing Co Ltd, said that at this stage, the most priority common goal of the semiconductor industry is to take into account sustainable development while continuing to advance to advanced processes through innovative materials. Taiwan Semiconductor Manufacturing Co Ltd attaches great importance to the impact of material quality on the yield of advanced process. last year, he built the first advanced materials analysis center to check the material evaluation and selection of advanced process and system integrated chips, and continuously optimize the yield of the process. we will continue to promote the sustainable development of the global industry.

Cao Shilun, global marketing director of SEMI, said that strategic materials are closely related to the sustainable development of semiconductors, and it is also the key for the industry to maintain a leading competitive advantage. In view of the application prospect of semiconductor materials, according to the SEMI report, the semiconductor material market is expected to grow by 8.6% in 2022, reaching a new high of US $69.8 billion, of which the wafer material market will grow by 11.5% to US $45.1 billion and the packaging material market will grow by 3.9% to US $24.8 billion. By 2023, the overall material market is expected to exceed 70 billion US dollars.

He Jun, Deputy General Manager of quality and Reliability of Taiwan Semiconductor Manufacturing Co Ltd, pointed out: "the linewidth of the chip is getting narrower and narrower, and it is more and more difficult to break through Moore's Law." In order to continuously realize the challenge of multiple transistors per unit area, relying on packaging technology, system integration and even material innovation and research and development are important factors to promote the sustainable development of advanced technology.

The translation is provided by third-party software.


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