In mid-March this yearSemiconductor Manufacturing International CorporationAnnounced the construction of a new 12-inch fab in Shenzhen at a cost of US $2.38 billion.

According to the announcement of Shenzhen Pingshan District Investment Promotion Service, the intended site for this project is Semiconductor Manufacturing International Corporation IC Manufacturing (Shenzhen) Co., Ltd., with a total construction area of about 69410 square meters (subject to the land transfer contract).

It is reported that the products of this project are located in 12-inch 28nm and above linewidth display driver chips and power management chips.

The project will build new facilities such as gas stations and chemical warehouses, which can provide nitrogen, oxygen and other bulk gases, as well as acids and bases, with a production capacity of 40,000 12-inch wafers per month.

According to the announcement of the cooperation framework agreement issued by Semiconductor Manufacturing International Corporation in March, the new investment in the project is estimated to be 2.35 billion US dollars and is expected to be put into production next year.

Semiconductor Manufacturing International Corporation's 12-inch project this year is not the only one in Shenzhen. According to its announcement on September 3, the company will plan to build a 12-inch 28nm wafer foundry production line in the Hong Kong free trade zone, with a planned investment of US $8.87 billion and a monthly production capacity of 100000 pieces, which is higher than that of the Shenzhen Pingshan District project.

In addition, the company also said that it will continue to expand its monthly production capacity of 12 inches for 10, 000 tablets and 8 inches for 45000 tablets this year, which will also be released next year.

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# Chip # Semiconductor Manufacturing International Corporation