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6-K: Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

SEC ·  Oct 4 05:21

Summary by Futu AI

Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.
Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.

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