This announcement is a separate document:
東京応化工業：10 nmの限界を突破！線幅7.6 nmの半導体微細加工を可能にする高分子ブロック共重合体の開発に成功
Tokyo Ohka Kogyo: Successful development of a high-molecular-weight block copolymer that enables semiconductor fine processing with a line width of 7.6 nm, breaking the limit of 10 nm.
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