Summary by Futu AI
China National Building Material Co., Ltd. announced that the coupon rate of its technology innovation corporate bonds (third phase) to be publicly issued to professional investors in 2024 has been determined. According to the approval of the China Securities Regulatory Commission, the company is allowed to issue corporate bonds with a total amount not exceeding RMB 20 billion. The issue size of this phase of bonds is no more than RMB 2 billion, with a term of 3 years. After consultation with the lead underwriter, the coupon rate of this phase of bonds has finally been set at 2.05%. The bond will be privately placed to institutional investors on August 13, 2024. Specific subscription methods have been announced on the website of the Shanghai Stock Exchange on August 9, 2024.