On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.

On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.