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華虹半導體:董事會會議日期通知

HUA HONG SEMI: Notification of Board Meeting

HKEX ·  Jul 25, 2024 04:30

Summary by Futu AI

華虹半導體有限公司(「本公司」)將於2024年8月8日(星期四)上午10時30分召開董事會會議。會議的主要目的是考慮及批准公布公司及其附屬公司2024年第二季度(4月1日至6月30日)的未經審核財務業績。此外,會議還將商討其他事項。該通知由公司董事長兼執行董事張素心先生於2024年7月25日從中國上海發出。
華虹半導體有限公司(「本公司」)將於2024年8月8日(星期四)上午10時30分召開董事會會議。會議的主要目的是考慮及批准公布公司及其附屬公司2024年第二季度(4月1日至6月30日)的未經審核財務業績。此外,會議還將商討其他事項。該通知由公司董事長兼執行董事張素心先生於2024年7月25日從中國上海發出。
Hua Hong Semiconductor Limited (the “Company”) will hold a board of directors meeting at 10:30 am on Thursday, August 8, 2024. The main purpose of the meeting is to consider and approve the unaudited financial performance of the Company and its subsidiaries for the second quarter of 2024 (April 1 to June 30). In addition, the meeting will also discuss other matters. This notice was issued by Mr. Zhang Suxin, the Chairman and Executive Director of the Company, on July 25, 2024 from Shanghai, China.
Hua Hong Semiconductor Limited (the “Company”) will hold a board of directors meeting at 10:30 am on Thursday, August 8, 2024. The main purpose of the meeting is to consider and approve the unaudited financial performance of the Company and its subsidiaries for the second quarter of 2024 (April 1 to June 30). In addition, the meeting will also discuss other matters. This notice was issued by Mr. Zhang Suxin, the Chairman and Executive Director of the Company, on July 25, 2024 from Shanghai, China.

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