This announcement is a separate document:
日本電気硝子：次世代半導体パッケージ向けガラスセラミックスコア基板「GCコア」を開発 ～高速でクラックレスかつ経済的な微細貫通穴（ビア）加工を実現～
Nippon Electric Glass: Developed glass ceramic core substrate "GC Core" for next-generation semiconductor package, realizing fast, crack-free, and economical micro-via processing.
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