share_log

6-K: Report of foreign private issuer [Rules 13a-16 and 15d-16]

SEC announcement ·  Apr 25 18:08
Summary by Futu AI
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), listed on the NYSE as TSM, has filed a Form 6-K with the United States Securities and Exchange Commission for the month of April 2024. The report, signed by Senior Vice President and Chief Financial Officer Wendell Huang on April 25, 2024, details several key updates regarding the company's shareholdings and financial activities for March 2024. Notably, there were minor changes in the shareholdings of TSMC's board of directors and executive officers, with Chairman Mark Liu's shares increasing by 415, while Senior Vice President Wei-Jen Lo's shares decreased by 45,000. Vice President and Chief Information Officer Chris Horng-Dar Lin's shareholdings increased by 2,000. No changes in the pledge of TSMC common shares were reported. TSMC and its subsidiaries made a significant fixed-income investment of NT$20.0 billion. Additionally, TSMC issued unsecured bonds totaling NT$22.8 billion, with varying maturities and a coupon rate of 1.64%, to be repaid annually.
Helpful
Not Helpful

This announcement is a separate document:

Doc 1

The information provided by Futu AI is automatically generated by third-party artificial intelligence (AI) software based on news content. It is only available to users located outside of China mainland.


The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.