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上海復旦：海外監管公告 - 向不特定對象發行A 股可轉換公司債券之發行保薦書

SHANGHAI FUDAN: An announcement has just been published by the issuer in the Chinese section of this website, a corresponding version of which may or may not be published in this section

香港交易所 ·  Apr 8 22:31
Summary by Futu AI
上海復旦微電子集團股份有限公司（簡稱「上海復旦」）於2024年4月8日宣布，將向不特定對象發行A股可轉換公司債券。該項目由中信建投證券股份有限公司擔任發行保薦人。本次發行的可轉債將用於新一代FPGA平台開發及產業化項目、智能化可重構SoC平台開發及產業化項目、新工藝平台存儲器開發及產業化項目、新型高端安全控制器開發及產業化項目和無源物聯網基礎芯片開發及產業化項目。上海復旦表示，募集資金將有助於提升公司核心技術水平和產品競爭力，促進主營業務發展，並促進公司科技創新水平的持續提升。本次發行的可轉債將於發行結束後六個月開始轉股，轉股期限至債券到期日止。該公司強調，募集資金投向符合國家產業政策要求，並不存在虛假記載、誤導性陳述或重大遺漏。
上海復旦微電子集團股份有限公司（簡稱「上海復旦」）於2024年4月8日宣布，將向不特定對象發行A股可轉換公司債券。該項目由中信建投證券股份有限公司擔任發行保薦人。本次發行的可轉債將用於新一代FPGA平台開發及產業化項目、智能化可重構SoC平台開發及產業化項目、新工藝平台存儲器開發及產業化項目、新型高端安全控制器開發及產業化項目和無源物聯網基礎芯片開發及產業化項目。上海復旦表示，募集資金將有助於提升公司核心技術水平和產品競爭力，促進主營業務發展，並促進公司科技創新水平的持續提升。本次發行的可轉債將於發行結束後六個月開始轉股，轉股期限至債券到期日止。該公司強調，募集資金投向符合國家產業政策要求，並不存在虛假記載、誤導性陳述或重大遺漏。
SHANGHAI FUDAN MICROELECTRONICS GROUP CO., LTD. (“SHANGHAI FUDAN”) ANNOUNCED ON APRIL 8, 2024 THAT IT WILL ISSUE A SHARE CONVERTIBLE CORPORATE BONDS TO UNSPECIFIED PARTIES. The project is sponsored by CITIC Securities Co., Ltd., as Issuer Sponsor. This issuance of transferable debt will be used for next-generation FPGA platform development and industrialization projects, intelligent reconfigurable SoC platform development and industrialization projects, new process platform memory development and industrialization projects, new high-end security controller development and industrialization projects, and IoT infrastructure chip development and industry Optimize the project. Shanghai Fudan said that the fundraising will help improve the company's core technology level and product competitiveness, promote the development of the main business, and promote the continuous improvement of the company...Show More
SHANGHAI FUDAN MICROELECTRONICS GROUP CO., LTD. (“SHANGHAI FUDAN”) ANNOUNCED ON APRIL 8, 2024 THAT IT WILL ISSUE A SHARE CONVERTIBLE CORPORATE BONDS TO UNSPECIFIED PARTIES. The project is sponsored by CITIC Securities Co., Ltd., as Issuer Sponsor. This issuance of transferable debt will be used for next-generation FPGA platform development and industrialization projects, intelligent reconfigurable SoC platform development and industrialization projects, new process platform memory development and industrialization projects, new high-end security controller development and industrialization projects, and IoT infrastructure chip development and industry Optimize the project. Shanghai Fudan said that the fundraising will help improve the company's core technology level and product competitiveness, promote the development of the main business, and promote the continuous improvement of the company's level of technological innovation. The convertible debentures of this issue will commence transposition six months after the end of the issue, with a transfer period until the maturity date of the Notes. The company stressed that the fundraising was directed to comply with national industrial policy requirements and that there were no false records, misleading statements or material omissions.

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