Summary by Futu AI
Shanghai Fudan Microelectronics Group Co., Ltd. (abbreviated as “Shanghai Fudan”) plans to issue A-share convertible corporate bonds to an unspecified audience, with a total amount not exceeding RMB200 billion. The bond is for a period of six years and will be listed on the Shanghai Stock Exchange's Sci-Fi Board. This issuance is still subject to registration with China Securities and Exchange Commission. The sponsor is Zhongxin Jiane Securities Co., Ltd. Referral representatives are Zhao Fengbin and Zhu Jin Chai. The funds raised will be used for next-generation FPGA platform development and industrialization projects, intelligent reconfigurable SoC platform development and industrialization projects, new process platform memory development and industrialization projects, new high-end security controller development and industrialization...Show More