This announcement is a separate document:
宏光半導體：自願公佈 - (I)建議採納二零二三年股份獎勵計劃及(II)有關清償貸款的諒解備忘錄
HG SEMI: VOLUNTARY ANNOUNCEMENT - (I) PROPOSED ADOPTION OF 2023 SHARE AWARD SCHEME AND (II) MEMORANDUM OF UNDERSTANDING TO LOAN SETTLEMENT
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