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SK Hynix has developed a UFS 4.1 solution product based on 321-layer NAND flash memory.

Breakings ·  May 22 08:26

SK Hynix has announced that the company has successfully developed a mobile solution product UFS 4.1 equipped with the world's highest 321-layer 1Tb (Terabit) TLC (Triple Level Cell) 4D NAND flash memory. The new product developed by the company has improved energy efficiency by 7% compared to the previous generation based on 238-layer NAND flash memory. At the same time, the product thickness has been successfully reduced from 1mm to 0.85mm, making it suitable for ultra-thin Smart Phones.

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