Scientists from institutions such as Columbia University and Cornell University in the USA have collaborated to develop a new type of three-dimensional optoelectronic chip by deeply integrating photonic technology with advanced complementary metal-oxide-semiconductor electronic technology. This chip achieves unprecedented data transmission energy efficiency and bandwidth density, laying a solid foundation for the development of the next generation of AI hardware. The related research paper has been published in the latest issue of Nature Photonics.
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新型光电子芯片能效和带宽创纪录
The new type of optoelectronic chip achieves record energy efficiency and bandwidth.
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