Wuxi Autowell Technology Co., Ltd. stated during the investor relations event that due to the increased demand from the recovery of the Semiconductor packaging and testing Industry Chain, the company has received positive feedback from client trials of products such as Aluminum wire bonders and AOI devices, and has received bulk Orders, showing promise to achieve the goal for new Orders for semiconductor equipment set at the beginning of the year. The Dicing Saw and die bonder have been validated with clients; CMP equipment is in the internal debugging stage and is expected to be sent for client validation in 2025.