On December 20 local time, the USA Department of Commerce announced that it would provide Samsung Electronics with up to 4.745 billion USD in direct funding under the chip incentive program. This funding will support Samsung in investing over 37 billion USD in the coming years to transform its existing facilities in Central Texas into a comprehensive ecosystem for chip development and production in the USA, including the construction of two new logic wafer fabs and a research wafer fab, as well as the expansion of its existing facilities in Austin.
三星电子获美国47.45亿美元芯片补贴
Samsung Electronics received a subsidy of 4.745 billion USD for chips from the USA.
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