The Dongxing Research Reports point out that the current Hardware innovation cycle, combined with the AI wave, is bringing the electronics Industry into a new development phase. The rise of large AI models has created a massive demand for computing power, while the significant increase in data processing and transmission rates has raised the requirements for chip memory capacity and transmission bandwidth for AI Servers. As a high-performance DRAM based on 3D stacking technology, HBM breaks the bottlenecks of memory bandwidth and power consumption. TrendForce estimates that by 2025, HBM will contribute 10% of total DRAM output, doubling its figure from 2024. Due to the high average price of HBM, its contribution to the total output value of the DRAM industry is expected to exceed 30%. It is anticipated that by 2029, the HBM market size will grow to 7.95 billion dollars. (Securities Times)