Shenzhen TXD Technology announced that the company has signed a supplementary agreement regarding the "Capital Increase Agreement" with Riyue New Semiconductor Co., Ltd. and Kunshan Riyue Tongxin Semiconductor Co., Ltd. According to the supplementary agreement, due to the need for an extension related to asset evaluation matters, Riyue New Semiconductor will complete the second batch of capital contribution to the target company with assets such as cleanroom workshops and supporting facilities, and the timeline has been adjusted from the original December 15, 2024, to December 31, 2024. The signing of this supplementary agreement will not have a significant adverse impact on the company's financial and operational status, nor will it affect the company's long-term deployment and strategic planning in chip packaging and testing projects.