According to reports from The Information, Apple’s collaboration with Broadcom this time is not a traditional complete design and production outsourcing, but instead Broadcom will provide certain key "chiplets". Chiplets are a design approach that modularizes the processor functionality, allowing Apple to combine multiple chiplets into a complete chip. This approach not only simplifies the manufacturing process but also effectively protects Apple's overall design secrets, so even partners cannot fully understand the chip’s architecture. It is reported that the processor, codenamed "Baltra", will be produced by Taiwan Semiconductor using the N3P process. N3P is an advanced process technology that Taiwan Semiconductor will release in April 2024, and it is expected to be first applied to the processor of the iPhone 17 Pro. This process technology has higher performance and energy efficiency advantages, providing strong support for AI servers.