Semi-best Semiconductor Equipment (Shanghai) Co., Ltd. announced today via their official WeChat account that its Ultra Fn A plasma-enhanced atomic layer deposition pipe equipment (PEALD), set to launch in 2024, has preliminarily passed process verification from a semiconductor client in mainland China and is undergoing final optimization in preparation for mass production. Semi-best Shanghai also announced that its Ultra Fn A thermal atomic layer deposition equipment (Thermal ALD), launched in 2022, has successfully passed process verification from another leading client in mainland China, with performance parameters on par with or even superior to similar international competitors.
盛美上海：等离子体增强原子层沉积炉管设备通过初步验证
Shengmei Shanghai: The plasma-enhanced atomic layer deposition furnace tube equipment has passed preliminary validation.
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