At the Intel New Quality Productivity Technology Ecosystem Summit held today, Wang Rui, Senior Vice President of Intel and Chairman of Intel China, stated that there are two key points of expanding the Chengdu packaging and testing base: first, to increase the production capacity of server chips, allowing the Chengdu packaging and testing base to cover a wide range of products from client to server chips, extensively meet the needs of the Chinese market, significantly shorten the response time to customers, and enhance the resilience of the supply chain; second, to establish a one-stop customer solution center, creating a comprehensive platform to drive digital transformation of enterprises. These two developments will accelerate the local industry chain support, increase and deepen support for Chinese customers.