On November 19, Applied Materials announced the establishment of a new heterogenous integration collaboration platform in Singapore, aiming to promote collaboration within the industry and drive innovation in new chip architecture, materials, and processes. The EPIC Advanced Packaging collaboration platform plans to collaborate with industry players including AMD, Taiwan Semiconductor, Samsung, and Intel, as well as local academic institutions such as the National University of Singapore, Nanyang Technological University, the Institute of Microelectronics under the Agency for Science, Technology and Research (A*STAR), and Singapore Polytechnic.