Xingchen Technology stated on the interactive platform that from September 25-27, the company participated in the 11th Automotive Electronics Innovation Conference (AEIF 2024) and Automotive Electronics Application Exhibition at the Taihu International Expo Center in Wuxi. At this exhibition, the company showcased its latest achievements in the car-grade chip field, including multiple products such as SAC8904, SAC8542, SAC8539, SAC8901, SAC8902, SAC8712, with some products already achieving large-scale production at major OEMs. In addition to the chip technology display, the company also brought terminal products and application solutions based on self-developed chips, including front-facing recorders, streaming rearview mirrors, DMS/OMS, CMS, 1V1R dual warning systems, as well as integrated ADAS parking solutions.