Shenzhen TXD Technology stated on the interactive platform that the company's chip testing and packaging project is progressing smoothly, operating well, and is expected to make a positive contribution next year. In addition, the company has always attached importance to expanding the application fields of products and reserving new technologies, and has laid out related research and development in the naked eye 3D field.
同兴达：芯片封测项目进展顺利 预计明年产生正向贡献
Shenzhen TXD Technology: The chip packaging and testing project is progressing smoothly and is expected to make a positive contribution next year.
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