Daiwa semiconductor industry analyst Jian Jiahong pointed out that Samsung is expected to outsource its HBM4 substrate technology to Taiwan Semiconductor in 2026, and adopt the 12nm/6nm process. Taiwan Semiconductor, facing strong demand, is actively expanding its production capacity, with capital expenditure expected to increase to $38 billion in 2025.
大摩：三星HBM4技术将外包给台积电
Daiwa: Samsung's HBM4 technology will be outsourced to Taiwan Semiconductor.
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