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市场消息:台积电和Amkor将在亚利桑那州合作开发先进封装

Market news: Taiwan Semiconductor and Amkor will collaborate to develop advanced packaging in Arizona.

Breakings ·  Oct 4 07:41

According to a company, Taiwan Semiconductor and Amkor Technology have signed a memorandum of understanding to collaborate on advanced packaging and testing capabilities in Arizona, announced on Friday.

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