Delong Laser (688170) recently stated during institutional research that the company has been developing advanced packaging applications for integrated circuits since 2021, such as laser grooving (low-k), wafer marking, and other laser fine machining equipment. In 2023, the company will focus on developing new products for laser fine machining equipment, such as glass through glass (TGV), module drilling (TMV), and laser debonding. The company has received batch orders for integrated circuit advanced packaging equipment in the first half of the year, and some new products are still in the process verification stage. The orders for integrated circuit advanced packaging equipment related to applications have grown year-on-year in the first half of this year, but due to the small base in the previous period, the proportion reflected in the revenue side is still low.