Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. (referred to as "Shengmei Shanghai") launched the Ultra ECP ap-p panel-level electroplating equipment for fan-out panel-level packaging (FOPLP) today. The equipment uses Shengmei Shanghai's self-developed horizontal electroplating to ensure good uniformity and accuracy of the panel.
盛美上海推出新型面板级电镀设备
Shengmei Shanghai has launched a new panel-level electroplating equipment.
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