TrendForce Cofin Consulting's research report states that since the second quarter, chip manufacturers such as AMD have actively contacted Taiwan Semiconductor and OSAT manufacturers to use FOPLP technology for chip packaging, driving attention to FOPLP technology in the industry. The estimated mass production time points for FOPLP packaging technology in consumer IC and AI GPU applications may fall between the second half of 2024 and 2026, and 2027-2028, respectively.
机构：AMD与英伟达需求推动FOPLP发展，预估量产时间落在2027-2028年
Institutions: AMD and Nvidia are driving the development of FOPLP, with an estimated production time in 2027-2028.
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