TrendForce Jibang Consulting pointed out that currently, OSAT manufacturers are competing to develop FOWLP and FOPLP technologies to provide lower cost packaging solutions. The main advantages of FOPLP technology are low unit cost and large package size. However, the development of technology and equipment systems is still in progress, and the commercialization process of technology is highly uncertain. It is estimated that the mass production time of POPLP packaging technology in consumer IC and AI GPU applications may fall between the second half of 2024 and 2026, and between 2027 and 2028.
TrendForce：AMD与英伟达需求推动FOPLP发展，预估量产时间落在2027-2028年
TrendForce: Demand from AMD and Nvidia is driving the development of FOPLP, with an estimated production time of 2027-2028.
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