With the advanced packaging concept anomaly boost, Epoxy Base Electronic Material Corporation was straight up and limit up, Verisilicon Microelectronics (Shanghai) Co., Ltd. surged 7%, while Bewinner, JCET Group Co., Ltd., Huahai Chengxin Technology, Yonker Technologies, and other stocks followed suit. On the news front, Samsung Electronics' advanced packaging (AVP) division is leading the development of "semiconductor 3.3D advanced packaging technology", which aims to be used in AI semiconductor chips and is expected to enter mass production in the second quarter of 2026. Samsung expects that after the new technology is commercialized, its performance will not decrease compared with the existing silicon intermediate layer, and the cost can be reduced by 22%. Samsung will also introduce "Panel Level Packaging (PLP)" technology in 3.3D packaging.
先进封装概念异动拉升 宏昌电子直线涨停
Advanced packaging concept anomaly boost, Epoxy Base Electronic Material Corporation straight up and limit up.
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