Morgan Stanley Research Report pointed out that Apple may use Taiwan Semiconductor's stacked SoIC-X advanced packaging technology in the upcoming M5 series chip, which will be used for AI servers. Apple may achieve mass production of M5 chips in the second half of next year, and it is expected that Taiwan Semiconductor will significantly expand its SoIC capacity next year. Currently, Apple is using the M2 Ultra chip in its AI server cluster, and the expected usage this year may reach about 200,000.
大摩：苹果下一代AI芯片或使用台积电产品
According to Morgan Stanley, Apple may use Taiwan Semiconductor's stacked SoIC-X advanced packaging technology in its upcoming M5 series chips for AI servers. It is expected that Apple will achieve large-scale production of M5 chips in the second half of
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