It has been reported by the media that Taiwan Semiconductor is expanding its CoWoS production capacity across the board, and has found a site for advanced packaging in Huwei Park, Yunlin County, Taiwan. AI semiconductors are currently the focal point of the global chip market, with giants like Nvidia pairing AI compute chips with HBM memory. In the integration packaging process of computing chips with HBM, Taiwan Semiconductor has the highest level of maturity in CoWoS and has become the mainstream choice.
台积电正全面扩张CoWoS产能 先进封装领域需求旺盛
Taiwan Semiconductor is expanding its CoWoS production capacity across the board, and has found a site for advanced packaging in Huwei Park, Yunlin County, Taiwan. AI semiconductors are currently the focal point of the global chip market, with giants like
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