According to Goke Microelectronics, the company's AI edge computing and automotive SerDes chips will be unveiled for the first time at the 2024 World Artificial Intelligence Conference (WAIC 2024) on July 4th. The AI edge computing chip has abundant AI computing power, powerful encoding and decoding capabilities, supports training and inference integration, and supports large models. The automotive SerDes chip has the characteristics of low latency, long-distance transmission, multiple signal transmission, high security, and high reliability. (Reporter Huang Lu from Cailian Press)
国科微AI、车载两款芯片将于WAIC 2024首次公开
Hunan Goke Microelectronics' AI and automotive chips will be unveiled for the first time at WAIC 2024.
The translation is provided by third-party software.
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.