During a survey conducted by an institution, Ze Cheng Electronics mentioned that the current mainstream technology paths in the industry for manufacturing PCB used in FCBGA packaging are using ABF material and implementing it through SAP process or using PP material and implementing it through the improved semi-additive process (mSAP). However, these two process paths are currently restricted by foreign suppliers in terms of materials and equipment. Ze Cheng Electronics sent samples of 1.6T optical module PCBs manufactured using NCBF material and FIPIS technology for various performance tests at a leading optical module manufacturer.
则成电子：1.6T光模块PCB样品已送样某头部光模块厂商进行性能测试
Ze Cheng Electronics: Samples of 1.6T optical module PCB have been sent to a certain head optical module manufacturer for performance testing.
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