According to THELEC, South Korean backend equipment manufacturer ASMPT has provided a demo thermal compression (TC) bonder for high-bandwidth memory production to Micron. The two sides have started joint development of the next generation bonder for HBM4 production. Micron also purchased TC bonders from Shin-Kawasaki Semiconductor in Japan and Kormax System in South Korea for HBM3E production. However, according to sources, since Shin-Kawasaki is supplying TC bonders to its largest customer, Samsung Electronics, it cannot timely respond to Micron's demand. Therefore, Micron has added Kormax System as the second supplier and provided a TC Bonder purchase order worth KRW 22.6 billion to Kormax System in April this year. (Star Daily Report)
ASMPT与美光联合开发下一代HBM4键合设备
Asmpt collaborates with Micron to develop the next generation HBM4 bonding equipment.
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